SIL PAD TSP Q2000

The Q3AC-35 is a 0.005-inch glass-reinforced grease replacement thermal interface Q-Pad 3 Material which eliminates problems associated with thermal grease such as contamination of electronic assemblies and reflow solder baths. The TO-220 Q-Pad 3 may be installed prior to soldering and cleaning without worry. When exposed to modest heat and presure, the elastomer conforms to surface textures thereby creating an air-free interface between heat-generating components and heat sinks. Fibreglass reinforcement enables Q-Pad 3 to withstand processing stresses without losing physical integrity. It also provides ease of handling during application.

• UL94V-0 Flammability rating
• Eliminates processing constraints typically associated with grease
• Conforms to surface textures
• Easy to handle
• May be installed prior to soldering and cleaning without worry
• Sold per Pack of 10

Applications

Safety, Industrial