Thermal Interface Materials

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  Manufacturer Part No Order Code Description / Manufacturer
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Conductive Material Thickness Thermal Conductivity Thermal Impedance
 
 
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GP2200SF-0.020-02-0404
GP2200SF-0.020-02-0404 - Thermal Insulator, Gap Pad 2200SF .020

1893459

Thermal Insulator, Gap Pad 2200SF .020" 4" x 4" Sheet, 2 W/m.K, 0.508 mm, 10000 Mohm-m

BERGQUIST

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- 0.508mm 2W/m.K -
EYGN0912QG3S
EYGN0912QG3S - Thermal Insulator, PGS Composit Type, 0.026 W/m.K, 1 mm

2722984

Thermal Insulator, PGS Composit Type, 0.026 W/m.K, 1 mm

PANASONIC

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- 1mm 0.026W/m.K -
A16367-42
A16367-42 - Thermal Pad, Tflex HR600 Series, 2.8 W/m.K, Boron Nitride Filled, 0.5 mm, 229 mm

2484748

Thermal Pad, Tflex HR600 Series, 2.8 W/m.K, Boron Nitride Filled, 0.5 mm, 229 mm

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Boron Nitride Filled 0.5mm 2.8W/m.K -
EYGA091203PA
EYGA091203PA - Thermal Interface Material, EYG Series, 1700 W/m.K, Graphite Sheet, 0.025 mm

1800087

Thermal Interface Material, EYG Series, 1700 W/m.K, Graphite Sheet, 0.025 mm

PANASONIC

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- 0.025mm 1700W/m.K -
HTCP
HTCP - Heat Transfer Compound, Thermally Conductive, 2.5 W/m.K, Non-Silicone, Syringe, 2 ml

2663393

Heat Transfer Compound, Thermally Conductive, 2.5 W/m.K, Non-Silicone, Syringe, 2 ml

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860-1P
860-1P - Heat Transfer Compound, Thermally Conductive, Silicone, Jar, 470 ml

2889810

Heat Transfer Compound, Thermally Conductive, Silicone, Jar, 470 ml

MG CHEMICALS

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SP1500ST-0.008-00-0404
SP1500ST-0.008-00-0404 - SIL-PAD 1500ST .008

1893433

SIL-PAD 1500ST .008" 4" X 4" SHEET

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- 0.203mm 1.8W/m.K -
HTCP20S
HTCP20S - Heat Transfer Compound, Thermally Conductive, 2.5 W/m.K, Non-Silicone, Syringe, 20 ml

634920

Heat Transfer Compound, Thermally Conductive, 2.5 W/m.K, Non-Silicone, Syringe, 20 ml

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HTC35SL
HTC35SL - Heat Transfer Paste, Non-Silicone, Thermally Conductive, 0.9 W/m.K, Syringe, 35 ml

317962

Heat Transfer Paste, Non-Silicone, Thermally Conductive, 0.9 W/m.K, Syringe, 35 ml

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A16000-01
A16000-01 - Phase Change Material, Thermal, 3.8 W/m.K, Paste, Grey, 125°C Max Temp

2494482

Phase Change Material, Thermal, 3.8 W/m.K, Paste, Grey, 125°C Max Temp

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- - 3.8W/m.K -
HTCX35SL
HTCX35SL - Heat Transfer Paste, Non-Silicone, Thermally Conductive, 1.35 W/m.K, Syringe, 35 ml

1961591

Heat Transfer Paste, Non-Silicone, Thermally Conductive, 1.35 W/m.K, Syringe, 35 ml

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HTCA200
HTCA200 - Heat Transfer Compound, Non-Silicone, Thermally Conductive, 0.9 W/m.K, Aerosol, 200 ml

3026863

Heat Transfer Compound, Non-Silicone, Thermally Conductive, 0.9 W/m.K, Aerosol, 200 ml

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EYGA091202F
EYGA091202F - Thermal Interface Material, EYG Series, 1850 W/m.K, Graphite Sheet, 17 µm, 115 mm

2577402

Thermal Interface Material, EYG Series, 1850 W/m.K, Graphite Sheet, 17 µm, 115 mm

PANASONIC

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Graphite Sheet 17µm 1850W/m.K -
846-1P
846-1P - Grease, Electrically Conductive, Carbon Conductive, Jar, 495 ml

2889811

Grease, Electrically Conductive, Carbon Conductive, Jar, 495 ml

MG CHEMICALS

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EYGA091201M
EYGA091201M - Thermal Interface Material, EYG Series, 1950 W/m.K, Graphite Sheet, 10 µm, 115 mm

2577414

Thermal Interface Material, EYG Series, 1950 W/m.K, Graphite Sheet, 10 µm, 115 mm

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Graphite Sheet 10µm 1950W/m.K -
120-2.
120-2. - Heat Sink Compound, Silicone, Oil Based, Container, 2oz

3354106

Heat Sink Compound, Silicone, Oil Based, Container, 2oz

WAKEFIELD SOLUTIONS

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GEL10
GEL10 - Thermal Insulator, Gap Filler, Gel Foil, Silicone Foil, 1.5 W/m.K, 1 mm

2289769

Thermal Insulator, Gap Filler, Gel Foil, Silicone Foil, 1.5 W/m.K, 1 mm

FISCHER ELEKTRONIK

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- 1mm 1.5W/m.K -
K10-54
K10-54 - SIL-PAD, K-10, .006

936741

SIL-PAD, K-10, .006", TO-220

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- 0.152mm 1.3W/m.K 0.86°C/W
HTC700G
HTC700G - Heat Transfer Paste, Non-Silicone, Thermally Conductive, Cartridge, 700 g

1961583

Heat Transfer Paste, Non-Silicone, Thermally Conductive, Cartridge, 700 g

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HTS35SL
HTS35SL - Heat Transfer Paste, Silicone, Thermally Conductive, 0.9 W/m.K, Syringe, 35 ml

891344

Heat Transfer Paste, Silicone, Thermally Conductive, 0.9 W/m.K, Syringe, 35 ml

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860-4G
860-4G - Heat Transfer Compound, Thermally Conductive, Silicone, Sachet, 4 g

2811968

Heat Transfer Compound, Thermally Conductive, Silicone, Sachet, 4 g

MG CHEMICALS

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A15372-02
A15372-02 - Thermal Phase Change Material, 228.6 mm x 228.6 mm x 0.127 mm, 3.8 W/m.K

2494483

Thermal Phase Change Material, 228.6 mm x 228.6 mm x 0.127 mm, 3.8 W/m.K

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- 0.127mm 3.8W/m.K -
EYGS121803
EYGS121803 - Thermal Interface Material, EYG Series, 1700 W/m.K, Graphite Sheet, 0.025 mm

1800082

Thermal Interface Material, EYG Series, 1700 W/m.K, Graphite Sheet, 0.025 mm

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- 0.025mm 1700W/m.K -
GP3000S30-0.040-02-4/4
GP3000S30-0.040-02-4/4 - Thermal Insulator, .040

8783527

Thermal Insulator, .040", 4" x 4" Sheet, Gap Pad 3000 S30, 3 W/m.K, 2.5 kV, 1.016 mm, 85000 Mohm-m

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- 1.016mm 3W/m.K 0.66°C/W
HTSP50T
HTSP50T - Heat Transfer Paste, Thermally Conductive, 3.0 W/m.K, Silicone, Tube, 50 ml

725572

Heat Transfer Paste, Thermally Conductive, 3.0 W/m.K, Silicone, Tube, 50 ml

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