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Quantity | Price (ex VAT) |
---|---|
1+ | US$29.895 |
5+ | US$26.264 |
10+ | US$23.423 |
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Multiple: 1
US$29.90 (ex VAT)
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Product Information
ManufacturerDOW
Manufacturer Part No340
Order Code101685
Technical Datasheet
Dispensing MethodTube
Volume-
Weight100g
Product Range-
SVHCNo SVHC (23-Jan-2024)
Product Overview
Dow Corning® 340 Heat Sink Compound is applied to the base and mounting studs of transistors, diodes and silicon-controlled rectifiers. It can also serve as an effective thermal coupler for many heat sink devices where efficient cooling is required. It is also suitable for aircraft engines where heat sink properties are required.
- A grease-like silicon material, thickened with heat conductive metal oxides
- High thermal conductivity with low bleed
- No drying, hardening or melting
- Stable at high temperatures
- Suitable for the base and mounting studs of transistors, diodes and effective many heat sink devices
Technical Specifications
Dispensing Method
Tube
Weight
100g
SVHC
No SVHC (23-Jan-2024)
Volume
-
Product Range
-
Technical Docs (2)
Associated Products
3 Products Found
Legislation and Environmental
Country of Origin:
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
Tariff No:39100000
US ECCN:EAR99
EU ECCN:NLR
RoHS Compliant:Yes
RoHS
RoHS Phthalates Compliant:Yes
RoHS
SVHC:No SVHC (23-Jan-2024)
Download Product Compliance Certificate
Product Compliance Certificate
Weight (kg):.15
UN Hazard Code:3077