Product Information
Product Overview
The TMATE2905C is a 0.13mm reusable Phase Change Material (PCM) designed for ease of testing and re-works ability. It has a composite construction of a special malleable metal alloy and a high-performance PCM. At 50°C it begins to soften and flow, filling the microscopic irregularities of the thermal solution, thus reducing thermal resistance. It shows no thermal performance degradation after 1000 hours at 130°C or after 500 cycles from -25 to 125°C. The PCM softens and does not fully change state, resulting in minimal migration (pump-out) at operating temperatures. It is suitable for use with high frequency microprocessors, computer servers and thermal test stand applications.
- Low thermal resistance at low pressures
- Make and break thermal interface connection many times
- Naturally tacky at room temperature, no adhesive required
- No heat sink preheating required
- 5x10¹² Volume resistivity
- 4.2 Dielectric constant at 1MHz
Applications
Thermal Management, Computers & Computer Peripherals
Technical Specifications
Boron Nitride Film, Foil Reinforced
-
5000000000000ohm-cm
-
No SVHC (19-Jan-2021)
-
0.13mm
-
-
Technical Docs (1)
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:United States
Country in which last significant manufacturing process was carried out
RoHS
RoHS
Product Compliance Certificate