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Quantity | Price (ex VAT) |
---|---|
1+ | US$1,685.720 |
Product Information
Product Overview
Jetson AGX Orin 32GB H01 kit is built with Jetson AGX Orin 32GB module, offering 200 TOPs AI performance as well as a carrier board including PCIe X16, GbE, 10GbE, 3 x USB 3.2, HDMI 2.1, M.2 Key M, M.2 Key E, 2.4/5GHz Wi-Fi, Bluetooth, 16 lane MIPI CSI-2, 40-Pin header. The kit is pre-installed with JetPack 5.0.2, has a heatsink with a cooling fan and an aluminium case, while being an alternative option for the Jetson AGX Orin Dev Kit.
- On-device processing with up to 200 TOPS AI performance with low power and low latency
- Compact size at 107mm x 106.4mm x 70.5mm
- Pre-installed JetPack 5.0.2, Linux OS BSP, support Jetson software and AI frameworks & s/w platforms
Contents
Jetson AGX Orin 32GB ×1, Seeed carrier board ×1, Aluminium heatsink with fan ×1, Aluminium case ×1, 19V/4.74A (barrel jack 5.5/2.5mm) power adapter ×1.
Technical Specifications
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ARM
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Cortex-A78AE
Jetson AGX Orin 32GB, Carrier Board, Heatsink with Fan, Case, Power Adapter
To Be Advised
Technical Docs (1)
Associated Products
1 Product Found
Legislation and Environmental
Country in which last significant manufacturing process was carried outCountry of Origin:China
Country in which last significant manufacturing process was carried out
Product Compliance Certificate